Photodetector device

SPECTRAL SENSOR

Visible Hyperspectral Sensor

Integrate calibration, acquisition and models for water spectroscopy, feature recognition and instrument front ends.

DETECTOR / CORE SPECIFICATIONS

Core Photodetector Specifications

16 channels

Physical Bands

Physical spectral response channels

120 channels

Reconstructed Bands

Up to 120 output bands

1 nm

Reconstructed Spectral Resolution

Down to 1 nm

10 ms

Minimum Sampling Interval

Time between consecutive samples

ParameterVisibleNear-Infrared
Documented Wavelength Coverage380–1000 nm1000–2400 nm
Physical Bands16 physical bands; defined separately from reconstructed output bands
Reconstruction CapabilityUp to 120 reconstructed bands; reconstructed spectral resolution down to 1 nm
Temporal SamplingMinimum sampling interval 10 ms; this is not end-to-end latency including transmission, reconstruction and display
System OutputChannel signals, reconstructed spectra and image-analysis results depending on configuration
CalibrationSystem calibration using the light source, reference spectra, detector response and actual optical path

Core capabilities supplied by the company: 16 physical bands, up to 120 reconstructed bands, reconstructed resolution down to 1 nm and minimum sampling interval 10 ms. Operating range, speed, resolution and simultaneous performance depend on configuration and testing. Complete instruments retain their individual specification tables.

SENSOR INTEGRATION

For Instrument Integration

Handbook Coverage
380–1000 nm
Integration Elements
Source / Optical path / Detection / Algorithms
Configuration
Project-specific
01

Optical Matching

Select illumination, working distance and acquisition method for the target and its spectral features.

02

Acquisition & Calibration

Define dark-field, reference-spectrum, thermal-drift and data-output requirements.

03

Algorithms & Validation

Calibrate spectra and validate reconstruction and inversion models using samples and application conditions.

Device models, packaging, interfaces and complete specifications are confirmed for the selected solution.

CAMERA MODULE

Camera Module & Chip Details

Camera Sensor ModuleModule circuit board and photosensitive chip
Metasurface Packaging on the Chip SurfaceA thin layer of microscopic metasurface structures is packaged on the chip surface for spectral control.

Camera module and chip photographs

CONTACT

Technical Enquiries
& Collaboration.

Contact us for product selection, development
and project collaboration.

Get in Touch ↗
TECHNICAL COLLABORATIONBD@zhongkeyaoguang.com ↗

266 Fangzheng Avenue, High-tech Park, Liangjiang New Area, Chongqing, China

Zhongke Yaoguang (Chongqing) Optoelectronics Technology Co., Ltd.
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