STEP 01
Spectral Calibration
Reference sources and instruments measure channel responses to relate wavelength, intensity and channel signals.
TECHNOLOGY
Micro/Nanostructure Research
for Optical Information
Simulation, micro/nano research and application validation for optical acquisition, control and transmission.
SPECTRAL COMPUTING / ALGORITHM CHAIN
From On-Chip Acquisition to Spectral Information
Physical channels acquire encoded signals. Calibration and reconstruction recover spectral information, while recognition and inversion connect it to applications.
STEP 02
Spectral Reconstruction
Reconstruct up to 120 bands from 16 physical-channel responses, with resolution and stability evaluated against reference spectra.
STEP 03
Spectral Image Recognition
Combine spatial texture and spectral features for classification, region recognition and anomaly detection, retaining images for verification.
STEP 04
Spectral Feature Inversion
Build models using target characteristics, reference measurements and project samples; estimate parameters and evaluate application scope.
METASURFACE / EXPERIMENTAL RESULTS
From Metasurface Structures to Spectral Recovery
Metasurface samples, micro/nanostructure characterization and module spectral-imaging tests.
Physical samples and structural forms.
SEM characterization of metasurface arrays.
Microscopy of different unit-cell regions.
Monochrome Module × Metasurface: Spectral Recovery
Compare monochrome-module images with spectral recovery after metasurface integration.
METASURFACE OPTICS / DESIGN TO TEST
Metasurface Microlenses: Design, Fabrication & Coupling
STEP 01
Phase & Optical Path Design
Design planar microlens phase profiles and optical paths for the target band, numerical aperture and working distance.
STEP 02
Micro/Nano Sample Fabrication
Translate unit-cell and array layouts into fabrication using EBL, imprinting and supporting processes.
STEP 03
Structure & Focusing Characterization
Optical microscopy, SEM and spot measurements assess geometry, focus position and energy distribution.
STEP 04
Coupling & Insertion Loss
Compare actual inputs, receivers and reference paths to evaluate coupling efficiency, insertion loss and alignment sensitivity.
2D Optical Spot
Horizontal and Vertical Intensity Profiles
Sample insertion loss: 0.75 dB, for the reported sample, test optical path and alignment conditions.
04 / DEVICE & SYSTEM CO-DESIGN
Device Design
for System Requirements
Optical structures, signal conversion and electronic readout jointly determine equipment performance.
Co-design for the operating band, signal intensity and interface requirements.
Optical Input
Define incidence conditions and target signals
Devices & Micro/Nanostructures
Structure response and optical field control
Readout & Equipment Interfaces
Electronic signal chains and evaluation methods
06 / TECHNOLOGY FOUNDATION
From Optical Principles
to Validated
Device Designs
Building on simulation and EBL facilities,
we work with industry partners on design, fabrication and testing.
Simulation
Micro/nanostructure modeling, optical response simulation and parameter optimization.
EBL Micro/Nanofabrication
Electron-beam patterning and sample development using suitable materials and supporting fabrication processes.
Process & Packaging Collaboration
Material selection, fabrication processes and optoelectronic interface integration with process and packaging partners.
Joint Validation
Agree on test conditions, metrics and evaluation methods to guide the next iteration.
Materials, fabrication scope and supporting processes are confirmed for each project.
CONTACT
Technical Enquiries
& Collaboration.
Contact us for product selection, development
and project collaboration.
TECHNICAL COLLABORATIONBD@zhongkeyaoguang.com ↗
266 Fangzheng Avenue, High-tech Park, Liangjiang New Area, Chongqing, China
Zhongke Yaoguang (Chongqing) Optoelectronics Technology Co., Ltd.RESEARCH FOUNDATION